The Hynix HYMP112S64CP6-S6 Memory Module consists of 1 GB DDR2 SDRAM in Fine Ball Grid Array (FBGA) packages on a 200-pin glass-epoxy substrate. It provides a high performance 8 byte interface in 67.6 mm width form factor of industry standard. It is suitable for easy interchange and addition.

• This Certified Refurbished product is tested and certified by the manufacturer or by a third-party refurbisher to look and work like new, with limited to no signs of wear. The refurbishing process includes functionality testing, inspection, reconditioning and repackaging. The product ships with all relevant accessories, a minimum 90-day warranty, and may arrive in a generic white or brown box.

This Certified Refurbished product is tested and certified by the manufacturer or by a third-party refurbisher to look and work like new, with limited to no signs of wear. The refurbishing process includes functionality testing, inspection, reconditioning and repackaging. The product ships with all relevant accessories, a minimum 90-day warranty, and may arrive in a generic white or brown box.Hynix