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KISENG 250000pcs Leaded Solder Balls for BGA Rework Reballing (0.4mm)
SIZE
0.40mm
0.20mm
0.25mm
0.30mm
0.35mm
0.45mm
0.50mm
0.55mm
0.60mm
0.65mm
0.76mm
DESCRIPTION
Specification:
Qty: 250 000pcs/bottle
Qty: 250 000pcs/bottle
- Qty: 250 000pcs/bottle
- Validity:One year