Features:
High stability and reliability
Apply to CPU, VGA, LED, Chipset ang PC components
Low thermai resistance, high condutivity for heat transfer
Compliance with RoHS REACH PFOS requirement


Specifications:
Size:155*20mm(Length*Diameter)
Net weight:35g
Color:Grey


Packing content:
1 x Thermal Compound

• Thermal Compound Paste Large Needle HY510-TU20 for CPU VGA LED Chipset PC
• Thermal paste Large needle HY510-TU20 100% Brand New
• Thermal Compound Paste Large Needle HY410-TU20 for CPU VGA LED Chipset PC
• 3 to 12 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.
• A 3.5 gram syringe contains enough compound to cover at least 15 to 25 small CPU cores, or 6 to 10 large CPU cores, or 2 to 5 heat plates. At a layer 0.003" thick, the 3.5 gram syringe will cover approximately 16 square inches.

Thermal Compound Paste Large Needle HY510-TU20 for CPU VGA LED Chipset PCChinaHuaian