Feature :

* Apply to eMMC/eMCP of Samsung , Sandis k , Toshiba , Hynix , Micron , HTC , MTK , Intel etc .

* Apply to BGA153/169 ;BGA162/186 ;BGA221 test

* eMMC/eMCP data can be read and written fastly

* Accurate positioning on flat bottom pad and solder of eMMC/eMCP

* Support flat bottom and solder ball testing .

* Technical support and datasheet are available if you need .

* we are the original manufacturer and welcome anyone to be our distribution agents

* Professional manufacturer in all kinds of IC chip testing sockets and adapters.

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* More types of sockets and adapters for eMMC , eMCP , SOP , SSOP , TSSOP , QFP , QFN , BGA , SOT , MSOP , DFN and customize design , for customized socket and more product detail , please feel free to contact us .

Specification and Dimension :

* Type : Test &amp Programming Socket ( with pcb , pogo pin / probe )

* Package : eMMC153/169 , eMCP162/186 , eMCP221

* Pin Pitch : 0.5 mm;

* Applicable IC body size : 11.5X13mm , 12x16 mm , 12x18mm , 14x18mm

* eMMC/eMCP thickness : 0.8mm - 1.5mm

Package Including :

1 * eMMC/eMCP 3 IN 1 pogo pin adapter

1 * border limiter 11.5x13mm

1 * border limiter 12x16mm

1 * border limiter 12x18mm

1 * border limiter 14x18mm

Shipping :

* Shipped within 5 days

* It will take 7-15 days to arrive at your American Address ( Not the Amazon Standard Shipping for 17-28 business days

• Type : Test & Programming Socket ( with pcb , POGO PIN , SD Interface )
• Package : eMMC153/169 , eMCP162/186 , eMCP221
• Pin Pitch : 0.5 mm , Chip Thickness : 0.8mm - 1.5mm
• Applicable IC body size : 11.5X13mm , 12x16 mm , 12x18mm , 14x18mm
• Test different IC ( BGA153/169 , BGA162/186 , BGA221 ) by moving test socket position , very easy to operate .