Feature :

* Apply to eMCP of Samsung , Sandisk , Toshiba , Hynix , Micron , HTC , MTK , Intel etc .

* Apply to BGA221 test

* eMCP data can be read and written fastly

* Accurate positioning on flat bottom pad and solder of eMCP

* Support flat bottom and solder ball testing .

* Technical support and datasheet are available if you need .

* we are the original manufacturer and welcome anyone to be our distribution agents

* Professional manufacturer in all kinds of IC chip testing sockets and adapters.

 More Quantities with  LOWER PRICE!

* More types of sockets and adapters for eMMC , eMCP , SOP , SSOP , TSSOP , QFP , QFN , BGA , SOT , MSOP , DFN and customize design , for customized socket and more product detail , please feel free to contact us .  

Specification and Dimension :

* Type : Test & Burn in Socket ( to DIP48 )

* Package : eMCP221 , BGA221

* Pin Pitch : 0.5 mm

* Pin Count : 36 pins

* Applicable IC body size : 11.5x13 mm

* eMCP thickness : 0.8mm - 1.5mm

Package Including :

1 * eMCP221 to DIP48 adapter

1 * border limiter 11.5x13mm

Shipping :

* Shipped within 5 days

* It will take 7-15 days to arrive at your American Address ( Not the Amazon Standard Shipping for 17-28 business days 

• Type : Test & Burn in Socket ( To DIP48 )
• Package : eMCP221 , BGA221
• Pin Pitch : 0.5 mm , Pin Count : 36 pins , eMMC thickness : 0.8mm - 1.5mm
• Applicable IC body size : 11.5x13 mm
• More types of sockets and adapters for eMMC , eMCP , SOP , SSOP , TSSOP , QFP , QFN , BGA , SOT , MSOP , DFN and customize design , for customized socket and more product detail , please feel free to contact us .